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APDS-9005
Miniature Surface-Mount Ambient Light Photo Sensor
Data Sheet
Description
The APDS-9005 is a low cost analog-output ambient lightphotosensorinminiaturechipLEDlead-freesurface mount package. It consists of a photo sensor, whose spectral response is close to the CIE standard photopic observer,asshowinfigure2.TheAPDS-9005isidealfor applicationsinwhichthemeasurementofambientlight isusedtocontroldisplaybacklighting.MobileappliancessuchasthemobilephonesandPDAsthatdrawheavy currentfromdisplaybacklightingwillbenefitfromincorporatingthesephotosensorproductsintheirdesignsby reducingpowerconsumptionsignificantly.
Features
* Spectralresponsivityclosetothatofhumaneye * MiniatureChipLEDLeadfreesurface-mountpackage Height-0.55mm Width-1.60mm Depth-1.50mm * Lowsensitivityvariationacrossvariouslightsources * Recommendedoperatingtemperature:-40Cto85C * Vccsupply1.8to5.5V * Lead-freepackage,RoHScompliance
Application Support Information
* Outputlinearityacrosswideilluminationrange The Application Engineering Group is available to assist you with the application design associated with APDS- Applications 9005 ambient light photo sensor module. You can * Detection of ambient light to control display contactthemthroughyourlocalsalesrepresentativesfor backlighting additionaldetails. Mobiledevices-Mobilephones,PDAs Computingdevices-Notebooks,Webpads Consumerdevices-TVs,VideoCameras,DigitalStill Camera * Automatic Residential and Commercial Lighting Management * ElectronicSignsandSignals
Ordering Information
Part Number APDS-9005-00 Packaging Type Package Tape and Reel Quantity 6-pins Chipled package 500
I/O Pins Configuration Table
Pin 3 4 5 6
1 0.9 0.8 Response (a.u.) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 300 400 500 600 700 800 wavelength (nm) 900 1000 1100
Symbol VCC NC NC Nc NC Iout
Description VCC No Connect No Connect No Connect No Connect Out
Typical Application Circuit
Normalized sensor spectral response APDS-9005 EyeResponse
Figure 1. Typical application circuit for APDS-9005 Component RLOAD Recommended Application Circuit Component k ohm
Note: RefertoFigure11forGeneralLuminanceVsTypicalOutputVoltagefor differentRLOADvalues
Figure 2. Relative Spectral Response Vs Wavelength
CAUTIONS:Itisadvisedthatnormalstaticprecautionsbetakeninhandlingandassembly ofthiscomponenttopreventdamageand/ordegradationwhichmaybeinducedbyESD
Absolute Maximum Ratings
For implementations where case to ambient thermal resistanceis50C/W Parameter Storage Temperature Operating temperature Supply Voltage Symbol TS TA VCC Min. -40 -40 0 Max. 85 85 6 Units C C V
Recommended Operating Conditions
Parameter Supply Voltage Symbol VCC Min. .8 Max. 5.5 Units V Conditions
Electrical & Optical Specifications (Ta=25C)
Parameter Photo Current (I) Photo Current (II) Dark Current Light Current Ratio Rise Time Fall Time Peak sensitivity wavelength Settling Time pulsed at Vcc Propagation delay Storage delay Saturation voltage Symbol I_PH I_PH I_DARK I_PH3 / I_PH Tr Tf l Tset Td Ts Vsat Min. 8 .0 Typ. 40 44 300 . 5 5 500 0 5 5 Max. 5 Units uA uA nA ms ms nm ms ms ms V Vcc pulsed = 0V to 3V; Rload = .4K ohms; Lux = 00 () Rl = Kohm, Lux = 00 R = Kohm, Lux=00 R = 50Kohm, Lux = 00 Rl = Kohm, Lux = 00 R = Kohm, Lux=00 Conditions Vcc =.8V, Lux = 00 () Vcc =.8V, Lux = 00 () Vcc = 3V, Lux = 0
Note: 1) Illuminancebyincandescentlamp 2) WhiteLEDisusedaslightsource
Light Measurement Circuit and Waveforms
sensor-outputattains~95%of itsvoltagemagnitudecorrespondstothesetlightlevel
VCCPulsefromPG Tset SensorOutputatLoad
3
450.0E-6 400.0E-6 Output Current [A] 350.0E-6 250.0E-6 200.0E-6 150.0E-6 100.0E-6 50.0E-6 000.0E+0 0
Average I-Out Vs LUX at VCC=1.8V 1.2 1
AVG REL-IOUT Vs TEMP at 100LUX/1.8V
REL I-OUT
300.0E-6
0.8 0.6 0.4 0.2 0 -40
100 200 300 400 500 600 700 800 LUX
900 1000 1100
-20
0
20
40
60
80
100
TEMPERATURE [C]
Figure 3. Average Iout Vs Lux (Vcc = 1.8V, T=25C, White LED source)
AVG REL-IOUT Vs TEMP at 320LUX/1.8V
Figure 4. Average relative Iout Vs Temp (Vcc = 1.8V, T=25C, 100 Lux)
Avg REL I-Out Vs VCC
1.2 1.0
1.5 1.4 1.3 1.2
REL I-OUT
0.8 REL I-OUT 0.6 0.4 0.2 0 -40
1.1 1 0.9 0.8 0.7 0.6 0.5
-20
0
20 40 TEMPERATURE [C]
60
80
100
0
1
2
3 VCC
4
5
6
Figure 5. Relative Output Current Vs Temp (Vcc = 1.8V, 100 Lux)
ANGULAR RESPONSE 1.2 1 REL I-OUT 0.8 0.6 0.4 0.2 0 -100 -50 0 ANGLE in DEGREE[] 50 100
Figure 6. Relative Output Current Vs Vcc (Ta = 25C, 100Lux)
18.0E-3 RISE TIME [Seconds] 16.0E-3 14.0E-3 12.0E-3 10.0E-3 8.0E-3 6.0E-3 4.0E-3 2.0E-3 000.0E+0
AVG RISE TIME Vs LOAD RESISTANCE at VCC=1.8V
0
2000
4000
6000
8000
10000
12000
LOAD RESISTANCE [Ohms]
Figure 7. Relative Iout Vs Angle (Vcc = 1.8V, Ta = 25C)
Figure 8. Average Rise Time Vs Load Resistance at Vcc = 1.8V
4
1.80E-02 1.60E-02 FALL TIME [Seconds] 1.40E-02 1.20E-02 1.00E-02 8.00E-03 6.00E-03 4.00E-03 2.00E-03 0.00E+00 0
AVG FALL TIME Vs LOAD RESISTANCE at VCC=1.8V
1.0E-6 900.0E-9 800.0E-9 DarkCUrrent[A] 700.0E-9 600.0E-9 500.0E-9 400.0E-9 300.0E-9 200.0E-9 100.0E-9 000.0E+0 -40
Average IDark Vs TEMP at VCC=1.8V
2000
4000 6000 8000 LOAD RESISTANCE [Ohms]
10000
12000
-20
0
20 40 60 TEMPERATURE [C]
80
100
Figure 9. Average Fall Time Vs Load Resistance at Vcc = 1.8V
Figure 10. Dark current Vs temperature
1.4 1.2 Average Vout (V) 1.0 0.8 0.6 0.4 0.2 0.0 0
Average Vout vs Lux (Vcc = 1.8V, T = 25C, White LED Source) RL=1kohm RL=1.8kohm RL=2.2kohm RL=2.7kohm RL=3.3kohm RL=4.3kohm RL=5kohm RL=7.5kohm RL=12kohm 100 200 300 400 500 Lux 600 700 800 900 1000
Figure 11. General Luminance vs Typical Output Voltage (Vcc = 1.8V, T = 25C, Light Source = White LED)
5
APDS-9005 Package Outline
Top View
Bottom View
6
APDS-9005 Tape and Reel Dimension
Moisture Proof Packaging
Baking Conditions:
All APDS-9005 options are shipped in moisture proof Ifthepartsarenotstoredindryconditions,theymustbe package.Onceopened,moistureabsorptionbegins.This bakedbeforereflowtopreventdamagetotheparts. partiscomplianttoJEDECLevel3. Package Temperature Time
Units in A Sealed Mositure-Proof Package
In Reel In Bulk
60C 00C
48 hours 4 hours
Bakingshouldonlybedoneonce.
Recommended Storage Conditions:
Storage Temperature
Package Is Opened (Unsealed)
0 C to 30 C below 60% RH
Relative Humidity
Timefromunsealingtosoldering: Afterremovalfromthebag,thepartsshouldbesoldered within7daysandifstoredattherecommendedstorage conditions. If times longer than 7 days are needed, the partsmustbestoredinadrybox.
Environment less than 30 deg C, and less than 60% RH ?
Yes Package Is Opened less than 168 hours ?
No Baking Is Necessary
Yes
No
Perform Recommended Baking Conditions
No
8
Recommended Reflow Profile
255 T - TEMPERATURE (C) 230 217 200 180 150 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 200 P3 SOLDER REFLOW 250 P4 COOL DOWN 300 t-TIME (SECONDS) R1 MAX 260C R3 R4
R2
60 sec to 90 sec Above 217C R5
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down Time maintained above C Peak Temperature Time within 5C of actual Peak Temperature Time 5C to Peak Temperature
Symbol P, R P, R P3, R3 P3, R4 P4, R5
DT 5C to 50C 50C to 00C 00C to 55C 55C to 00C 00C to 5C > C 60C > 55C 5C to 60C
Maximum DT/Dtime or Duration 3C/s 00s to 80s 3C/s -6C/s -6C/s 60s to 90s 0s to 40s 8mins
The reflow profile is a straight-line representation of a nominal temperature profile for a convective reflow solder process.Thetemperatureprofileisdividedintofourprocesszones,eachwithdifferentDT/Dtimetemperaturechange ratesorduration.TheDT/Dtimeratesordurationaredetailedintheabovetable.Thetemperaturesaremeasuredat thecomponenttoprintedcircuitboardconnections. Process zone P1,thePCboardandAPDS-9005pinsareheatedtoatemperatureof150Ctoactivatethefluxinthe solderpaste.Thetemperaturerampuprate,R1,islimitedto3CpersecondtoallowforevenheatingofboththePC boardandAPDS-9005pins. Process zone P2 shouldbeofsufficienttimeduration(100to180seconds)todrythesolderpaste.Thetemperatureis raisedtoaleveljustbelowtheliquiduspointofthesolder,usually200C(392F). Process zone P3 isthesolderreflowzone.InzoneP3,thetemperatureisquicklyraisedabovetheliquiduspointof solderto255C(491F)foroptimumresults.Thedwelltimeabovetheliquiduspointofsoldershouldbebetween20 and40seconds.Itusuallytakesabout20secondstoassurepropercoalescingofthesolderballsintoliquidsolderand the formation of good solder connections. Beyond a dwell time of 40 seconds, the intermetallic growth within the solderconnectionsbecomesexcessive,resultingintheformationofweakandunreliableconnections.Thetemperatureisthenrapidlyreducedtoapointbelowthesolidustemperatureofthesolder,usually200C(392F),toallowthe solderwithintheconnectionstofreezesolid. Process zone P4 isthecooldownaftersolderfreeze.Thecooldownrate,R5,fromtheliquiduspointofthesolderto 25C(77F)shouldnotexceed6Cpersecondmaximum.ThislimitationisnecessarytoallowthePCboardandAPDS9005pinstochangedimensionsevenly,puttingminimalstressesontheAPDS-9005. Itisrecommendedtoperformreflowsolderingnomorethantwice.
9
Appendix A: SMT Assembly Application Note
1.0 Solder Pad, Mask and Metal Stencil Aperture
Stencil Aperture Metal Stencil For Solder Paste Printing
1.2 Recommended Metal Solder Stencil Aperture
It is recommended that a 0.11 mm (0.004 inches) thick stencil be used for solder paste printing. Aperture opening for shield pad is 0.4mm x 0.4mm and 0.2mm x 0.4mm (as per land pattern). This is to ensure adequate printedsolderpastevolumeandnoshorting.
Aperture Opening Land Pattern
Solder Mask PCBA 1.7
0.11 1.6 Unit: mm
Figure A3. Solder Stencil Aperture Figure A1. Stencil and PCBA
1.1 Recommended Land Pattern
C L 0.4
1.3 Adjacent Land Keepout and Solder Mask Areas
Adjacentlandkeep-outisthemaximumspaceoccupied by the unit relative to the land pattern.There should be nootherSMDcomponentswithinthisarea. The minimum solder resist strip width required to avoid solderbridgingadjacentpadsis0.2mm.
Note:Wet/LiquidPhoto-Imageablesolderresist/maskisrecommended. 2.6
0.3
0.45 0.9 Mounting Center
2.7
0.4 Unit: mm 0.2 0.4 0.2 MIN.
Figure A2. Recommended Land Pattern Figure A4 Adjacent Land Keepout and Solder Mask Areas
0
Appendix B: Optical Window Design for APDS-9005
Table 1 and Figure B3 below show the recommended dimensions of the window. These dimension values are 2.0 Optical Window Dimensions basedonawindowthicknessof1.0mmwitharefractive ToensurethattheperformanceoftheAPDS-9005willnot index1.585. beaffectedbyimproperwindowdesign,therearesome D1 constraintsonthedimensionsanddesignofthewindow. Top View Thereisaconstraintontheminimumsizeofthewindow, T whichisplacedinfrontofthephotolightsensor,sothat itwillnotaffecttheangularresponseoftheAPDS-9005. This minimum dimension that is recommended will ensureatleasta35lightreceptioncone. WD D2 D1 Ifasmallerwindowisrequired,alightpipeorlightguide can be used. A light pipe or light guide is a cylindrical piece of transparent plastic, which makes use of total internalreflectiontofocusthelight.
L
Z APDS-9005
LightRecevingArea Thethicknessofthewindowshouldbekeptasminimum as possible because there is a loss of power in every optical window of about 8% due to reflection (4% on Figure B3. Recommended Window Dimensions eachside)andanadditionallossofenergyintheplastic WD: Working Distance between window front panel material. &APDS-9005 Figure B1 and B2 illustrate the two types of window D1: WindowDiameter thatwehaverecommendedwhichcouldeitherbeaflat T: Thickness windoworaflatwindowwithlightpipe. L: LengthofLightPipe D2: LightPipeDiameter Z: Distance between window rear panel and APDS-9005 Table 1. Recommended minimum dimension for optical window
Figure B1. Window Size Determination for Flat Window
WD (T+L+Z) .5 .0 .5 3.0
Flat Window (L=0.0) Z 0.5 .0 .5 .0 D1 .05 .5 3.45 4.5
Flat window with Light Pipe D1/D2 .0/. T/L/Z .0/.5/0.5
Alldimensionsareinmm
Thewindowshouldbeplaceddirectlyontopofthelight receivingarea(activearea)ofthephotosensortoachieve betterperformanceandifaflatwindowwithalightpipe is used, dimension D2shouldbe1.2mm tooptimizethe performanceofAPDS-9005. Therecommendedminimumwindowdimensionisbased ontheassumptionthatthecenterofthewindowandthe center of the light receiving of the photo sensor are the same.Itisrecommendedthatthetoleranceforassembly be considered as well. The recommended minimum windowsizewhichwilltakeintoaccountoftheassembly toleranceisdefinedas: D1 (min + assembly tolerance) = D1min + 2*(assembly tolerance)(Dimensionsareinmm) Figure B2. Window Design of Flat Window with Light Guide D2 (min + assembly tolerance) = D2min + 2*(assembly tolerance)(Dimensionsareinmm)
2.1 Optical Window Material
Thematerialofthewindowisrecommendedtobepolycarbonate. The surface finish of the plastic should be smooth,withoutanytexture. Therecommendedplasticmaterialforuseasawindowis availablefromBayerAGandBayerAntwerpN.V.(Europe), BayerCorp.(USA)andBayerPolymersCo.,Ltd.(Thailand), asshowninTable2. Table 2. Recommended Plastic Materials Material number Makrolon LQ64 Makrolon LQ34 Makrolon LQ38 Visible light transmission 8% 8% 85% Refractive index .58 .58 .58
Appendix C : General Application Guide for APDS-9005
TheAPDS-9005isalowcostanalog-outputambientlight photo sensor whose spectral response closely emulates the human eyes. APDS-9005 consists of a photo sensor that is able to produce a high gain photo current to a sufficient level that can be converted to voltage with a standardvalueofexternalresistor.APDS-9005caneasily be integrated into systems that use ADC input which is availableforsamplingoftheexternalsource,asshownin figureC1below. The amount of converted voltage, Vout, is mainly dependant proportionally on the photo current which generated by the brightness of the light shone on the photo sensor and the load resistor used, RL. Increasing the brightness of the light or/and the load resistor will increasetheoutputvoltage. Brightnessismeasuredas"LUX"unit,whichdescribeshow intense a light source that our eyes perceive. LUX meter is the equipment for"LUX" measurement. Light sources withthesameLUXlevelappearatthesamebrightnessto thehumaneyes. Selection of the load resistor RL will determine the amountofcurrent-to-voltageconversioninthecircuit. Light source e.g. fluorescent light consists of ac noise frequency of about 100Hz. A capacitor of 10uF, which actasalow-passfilter,isrecommendedtoaddinparallel withtheloadresistortoreducetheripples.
Vcc 1 Light Source 6 APDS-9005 Vout A/D
2,3,4,5 NC
C
RL
microcontroller
Figure C1. Configuration of APDS-9005
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 00 Avago Technologies Limited. All rights reserved. Obsoletes AV0-0598EN AV0-0080EN - January 6, 00

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